Single in line memory module adapter

ABSTRACT

An adapter or housing for a module, such as a single in-line memory module (SIMM) or the like, and method of using the same are herein disclosed where the SIMM and attached housing fit a predetermined shape SIMM socket. The housing replaces SIMM board material that would otherwise be used to help secure the SIMM to a predetermined shape SIMM socket or connector. The configuration of the housing allows a SIMM or the like to be snapped or slid and secured into the housing. If desired, an adhesive, potting material and other bonding material can be used to secure the SIMM board to the housing and/or pot the SIMM within the housing.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to modules used in computers, such assingle in-line memory modules (SIMMs) and the like. More specifically,the present invention relates to a SIMM housing including a smallerprinted circuit board to form a standard outline module.

2. State of the Art

An integrated circuit (IC) typically includes a semiconductor die (die)electrically attached to a lead frame providing physical support for thedie and connecting the die to external circuitry, such as a printedcircuit board. In such an arrangement, the lead frame and die areconnected by forming wire bonds between the lead fingers of the leadframe and the bond pads located on a surface of the die. The die andlead frame are then typically encapsulated within a plastic package,although ceramic and metal packages may also be used depending on theoperating environment and the packaging requirements of the die.

As the demand for memory, in particular random access memory (RAM),surpassed the memory capability of a single die, multi-chip modules(MCMs) were developed having a number of memory devices attached to asingle substrate, such as a printed circuit board. A single in-linememory module (SIMM) is a multi-chip memory module having multiples ofthe same basic die, where the semiconductor memory chips are aligned ina row and interconnected to a printed circuit board to, in effect,create a single device with the memory capacity of the combined memorychips. Internal circuitry of the printed circuit board connects eachchip to terminals attached along one edge of the printed circuit board.The terminals are configured for attachment to an edge-type connector,such as a SIMM socket as is known in the art. As the demand foradditional memory on a single device has increased, other devices, suchas a dual in-line memory module (DIMM), have also been developed. Suchdevices, while providing the desired memory capability on a singleprinted circuit board, are relatively expensive to manufacture,requiring manufacture and/or purchase of relatively expensivecomponents.

As an increase in supply of SIMMs in the marketplace has dropped theprice of RAM, an even greater need to decrease the cost of manufacturingSIMMs exists. Because of advances in chip manufacturing technology andefficiency, manufacturers can produce thousands of chips per day. Withsuch high volume production rates, small improvements in efficiencyand/or cost reduction per chip can make substantial differences in thedaily cost of manufacturing. While manufacturers have continued tostreamline processes to improve efficiency and decrease productioncosts, the amount of materials used to form many standard components hasremained relatively constant.

One of the components of a SIMM is a printed circuit board, typicallycomprised of a fire-retardant, epoxy resin/glass cloth laminate,commonly referred to as FR-4. The epoxy resin used in the formation ofthe FR-4 board is typically diglycidyl ether of 4,4'-bis(hydroxyphenyl)methane, or other low-molecular weight polymers of it. Fire retardancyis imparted by including enough tetrabromobisphenol-A to provide 15% to20% bromine content. Sometimes, about 10% of higher functionality epoxyis added to raise the glass transition point and improve chemicalresistance of the resin by increasing cross-link density.

Other materials used in the manufacture of FR-4 boards include curingagents such as dicyandiamide (DICY) and catalysts such as tertiaryamines. DICY has low solubility in common organic solvents, so that thefull stoichiometric capability for linking the epoxy-bond network is notused. The molding flow is suited for multi-layer laminating needed forprinted circuit boards, and the cured physical properties are good withstrain to fracture ratio of about 0.04, thereby providing enoughresiliency for good metal or glass bond interfaces.

While FR-4 is the preferred material for the SIMM board, it is arelatively expensive part of the SIMM and can account for a substantialportion of the cost of the entire SIMM. Other high-performance boardsbased on such high glass-transition-temperature materials, such aspolyamide-glass or cyanate-glass, may also be used, but aresubstantially more expensive than FR-4. In addition to the cost ofmaterials, the care necessary to ensure an aesthetically pleasingcomponent requires special attention to be paid to the quality ofworkmanship. This additional care may require more detailed oradditional inspection of each component and slow the rate of production.

It is known in the art to provide containers for "plug-in" peripheralcards in the form of printed circuit boards contained within an exteriorpackage. These devices are termed "PCMCIA style peripheral devices"(PCMCIA being the acronym for Personal Computer Memory CardInternational Association) and are designed to be plugged-in and removedby the user. Hence, the cards are typically housed within a metal casethat protects the memory devices contained therein from being physicallycontacted and/or damaged by the user or environment. Such a device isillustrated in U.S. Pat. No. 5,397,857 to Farquhar et al.

SIMMs, on the other hand, are not typically housed and, as previouslydescribed, are simply printed circuit boards having a row of memorychips attached thereto and a row of connectors along one edge. Whiletypically being removably attached to a computer card, SIMMs tend toremain untouched once installed in a computer unless the amount ofmemory is changed by adding to or replacing one or more SIMMs.

An exception to a conventional SIMM configuration is taught in U.S. Pat.No. 5,109,318 to Funari et al. As described in U.S. Pat. No. 5,109,318,a housing for a conventional SIMM serves as a heat sink. Such a heatsink housing would add to the cost of the finished SIMM.

Therefore, a need exists for the fabrication of less costly SIMMs andthe like by reducing the quantity of material used to make the SIMMboard while allowing the SIMM to be mounted to an industry-standard SIMMsocket. In addition, the ability to cover the SIMM and any aestheticanomalies thereon has the added benefit of speeding the production rateof SIMMs.

SUMMARY OF THE INVENTION

Accordingly, a module, such as a single in-line memory module (SIMM) orthe like is provided comprised of a SIMM board and a SIMM holder oradapter configured to mate with a predetermined configuration SIMMsocket. The adapter, preferably made of a single-piece molded plastic,houses a reduced-size SIMM board, effectively replacing a portion of theboard material with a less-expensive adapter material. Such a SIMM,while compatible with SIMM sockets known in the art, requires less boardmaterial and is less expensive to produce than conventional SIMMs.

In a preferred embodiment, a module, such as a SIMM holder or adapter,includes two memory board retaining members, each having a substantiallylongitudinally extending slot sized and shaped to receive and secure amemory board such as a printed circuit board. The retaining members arealso configured to be at least partially received within a standard SIMMsocket as is known in the art. That is, a portion of each retainingmember fits into the SIMM socket to occupy the space that wouldotherwise be filled by a conventional SIMM board. In other words, theportion of the retaining member that fits in the SIMM socket fills thegap or gaps between the end or ends of the SIMM socket and thereduced-size SIMM board and helps to align the reduced-size SIMM boardrelative to the socket.

In another preferred embodiment, the retaining members are held inrelative relation to one another by a cross-member depending from andextending between the retaining members. The cross member preferablyincludes a longitudinally extending groove or slot sized and shaped toreceive the top edge of a module board. Thus, the cross-member and itsassociated retaining members form a C-shaped adapter that can hold amodule board therein.

In yet another preferred embodiment, the SIMM socket adapter accordingto the present invention is in the form of a housing having tworetaining members and at least one longitudinally extending wallextending from one retaining member to the other. Such a wall covers atleast a portion of the SIMM board and provides structural strength forthe adapter. A SIMM board positioned within the housing can be potted asis known in the art. Thus, the need to ensure that the SIMM board andthe chips and other components located thereon are aestheticallypleasing is not necessary.

In yet another preferred embodiment, the SIMM socket adapter includestwo socket connectors attached to and separated by a module housing. Themodule housing may include only one side wall, in which case at leastone protrusion or retaining portion on each side of the board may beneeded to secure the board to the adapter, or may include side walls onboth sides of the module board, in which case the board becomesessentially "sandwiched" between the two side walls. In either case, theboard and any components thereon can be potted by methods known in theart.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a prior art SIMM;

FIG. 2 is a perspective view of a first preferred embodiment of a SIMMadapter according to the present invention;

FIGS. 3A and 3B are schematic views of a reduced-size SIMM sized to fitwithin the SIMM adapter of FIG. 2;

FIG. 4 is a perspective view of the SIMM of FIGS. 3A and 3B insertedinto the SIMM adapter of FIG. 2.

FIG. 5 is a perspective view of a second embodiment of a SIMM adapteraccording to the present invention;

FIGS. 6A and 6B are schematic drawings of a third embodiment of a SIMMadapter according to the present invention;

FIG. 7 is a schematic drawing of a fourth embodiment of a SIMM adapteraccording to the present invention;

FIGS. 8A and 8B are schematic drawings of a fifth embodiment of a SIMMadapter according to the present invention;

FIG. 9 is a perspective view of a sixth embodiment of a SIMM adapteraccording to the present invention;

FIG. 10 is a perspective view of a seventh embodiment of a SIMM adapteraccording to the present invention;

FIG. 11 is a side view of a general illustration of the SIMM adapter ofthe present invention connected to another circuit board; and

FIG. 12 is a view of a module and module adapter of the presentinvention in conjunction with a computer.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENT

Referring to FIG. 1, a prior art, single in-line memory module (SIMM) 10is illustrated and comprised of a module board 12, typically a printedcircuit board, with a plurality of semiconductor devices 14 attachedthereto. In a SIMM, each of the semiconductor devices 14 are usually thesame type and size and arranged in a row longitudinally across theprinted circuit board 12. The printed circuit board 12 is generallyrectangular in shape and has a row of contacts 13 along a bottom edge 15of the board 12. The printed circuit board 12 also includes holes 16 and18 proximate each end 20 and 22 of the board 12, respectively, and aJ-shaped notch 24 on the corner 26 of the board 12 to assist alignmentof the contacts 13 with a SIMM socket or connector as is known in theart. As illustrated by dashed lines 28 and 30, the printed circuit board12 material, typically FR-4, between the dashed line 28 and the end 20and between the dashed line 30 and the end 22 is merely used to attachand align the SIMM 10 to a SIMM socket, and could be eliminated from theSIMM 10 without any loss of functionality. In order to properly attachand align the SIMM 10 to an industry standard SIMM socket, however,without the use of the adapter according to the present invention, theportions 17 and 19 of the board 12 extending beyond the lines 28 and 30are needed.

Referring now to FIGS. 2, 3A, 3B, and 4, a first preferred embodiment ofan adapter or housing 40 according to the present invention isillustrated. The housing 40, generally a rectangular box shape, iscomprised of a first side wall 42 and a second side wall 44 dependingfrom and extending between a first connector or retaining member 46 anda second connector or retaining member 48. The walls 42 and 44 and theconnectors 46 and 48 of the housing 40 form a chamber 41 into which aSIMM 60 or the like can be inserted (see FIGS. 3A and 3B), the walls 42and 44 being separated a distance sufficient to allow clearance for theSIMM 60 and any chips 66 or components 68 thereon. The walls 42 and 44may also include holes 43 and 45 and other features of a conventionalSIMM 10 so that the housing 40 and the SIMM 60 therein properly fitwithin a SIMM socket as known in the art.

To keep a SIMM 60 or the like securely positioned within the chamber 41,the connectors 46 and 48 define slots 50 and 52, respectively, thatlongitudinally extend along a length of each connector 46 and 48. Theslots 50 and 52 are sized and spaced from one another so that a SIMMboard 62 fits snugly therein. In addition, the connectors 46 and 48include extended portions or tabs 54 and 56, respectively, that arealigned with and generally the same width as the slots 50 and 52, andthus generally the same width W as the SIMM board 62. As shown in FIG.4, when the SIMM 60 is properly inserted into the housing 40, the tabs54 and 56 extend substantially the same distance as the bottom edge 64of the SIMM 60 so that the end surfaces 55 and 57 of the tabs 54 and 56,respectively, are substantially flush with the bottom edge 64. Ifdesired, once the SIMM 60 is properly inserted, any spaces between theSIMM 60 and the inside of the housing 40 could be potted or otherwisefilled with a potting or other compound known in the art to ensure thatthe SIMM 60 remains fixed to the housing 40.

Referring now to FIG. 5, another preferred embodiment of a holder oradapter 70 according to the present invention is illustrated. Thisembodiment is similar to the housing 40 of FIG. 2 but has only one sidewall 72 extending between the end portions or connectors 74 and 76.Thus, a SIMM such as SIMM 10, with portions 17 and 19 removed, can beinserted therein with the semicoductor devices 14 facing the inside ofthe side wall 72, or inserted with the chips 14 being exposed.Preferably, the semicoductor devices 14 face the inside of the side wall72 so that any aesthetic anomalies on the SIMM 10 are covered by theside wall 72. In addition, a J-shaped recess 78 may be incorporated inthe connector 74 to substantially duplicate the configuration of theSIMM 10 for proper seating of the adapter 70 and SIMM 10 within aconventional SIMM socket. Moreover, as with the housing 40, any spacesbetween the SIMM 10 and the inside of the side wall 72 can be potted orotherwise filled with other materials known in the art.

To illustrate that the present invention has applicability to variousmemory modules, the SIMM 60 of FIGS. 3A and 3B is of a differentconfiguration than the SIMM 10 of FIG. 1, SIMM 10 being an older typeconventional SIMM and the SIMM 60 being a more current SIMM version.Unlike the SIMM 10 of FIG. 1, however, SIMM 60, while otherwise having aconventional configuration, does not have the same length L as theconventional SIMM 10, (i.e., not including the portions 17 and 19 of theSIMM 10 illustrated in FIG. 1). By reducing the size or length L andthus the amount of material necessary to form the module board 62, theoverall cost of manufacturing the SIMM 60 is decreased. However, toconnect and properly align such a reduced-size SIMM 60 to a conventionalSIMM socket, as known in the art, the SIMM 60 can employ the adapter 40of the present invention, preferably made of a less expensive materialthan the material used to form the SIMM board 62. Thus, the adapter 40may be comprised of a single-piece molded plastic housing, or formed ofother materials known in the art.

In yet another preferred embodiment of the present invention, an adapter80 and SIMM 82 is illustrated in FIGS. 6A and 6B. The adapter 80 iscomprised of two connectors or end portions 84 and 86 having a thicknessT substantially equal to a thickness of the SIMM board 88 of the SIMM82. A C-shaped side wall 90 extends between and depends from the endportions 84 and 86 and substantially covers chips 92 of the SIMM 82. Theend portions 84 and 86 extend a distance beyond the side wall toward thebottom edge 94 of the SIMM board 88 so that the edges 96 and 98 of theend portions 84 and 86, respectively, are substantially longitudinallyflush with the bottom edge 94. Thus, the side wall 90 is set back adistance from the bottom edge 94 to expose the connectors 100 of theSIMM 82. The SIMM board 88 is held in relation to the adapter 80 byretaining portions or protrusions 106 and 108 that extend over a portionof the back surface 109 of the SIMM board 88. Thus, to assemble the SIMM82 to the adapter 80, the SIMM 82 can simply be snapped into the adapter80. As with other preferred embodiments herein described, the adapter 80can include holes 102 and 104 and other features of conventional SIMMboards.

FIG. 7 is another preferred embodiment of an adapter 110 similar to theadapter 80 shown in FIGS. 6A and 6B, but having a pair of C-shaped sidewalls 112 and 114 housing a SIMM 116. As with other embodimentsdescribed herein, because the adapter 110 substantially encloses theSIMM 116 and thus protects the components of the SIMM 116, it is notnecessary to provide packaged chips on the SIMM 116 as is typically donewith conventional SIMMs. Thus, individual dice 118 can be wire bonded120 to the SIMM board 122 as shown or flip-chip bonded to the board 122as is known in the art. The chamber 124 can then be filled with apotting or other material known in the art to form a hermetic or nearhermetic seal around the dice 118.

FIGS. 8A and 8B illustrate yet another preferred embodiment of anadapter 130 that is comprised of two end retaining members 132 and 134similar to other embodiments herein described. The retaining members 132and 134 of this embodiment, however, are held in relative relation toone another by a slotted or channeled cross-member 136. The adapter 130thus fits around at least a portion of the perimeter of a SIMM, such asSIMM 60, and will properly align the SIMM 60 to a SIMM socket known inthe art. If desired, an adhesive or other bonding material can beinserted into the slot 138 to hold the adapter 130 onto the SIMM 60.

In FIG. 9, the adapter 140 may simply be comprised of two connectors orretaining members 142 and 144. The retaining members 142 and 144 form anadapter 140 similar to the adapter of FIGS. 8A and 8B but without thecross-member 136. Further illustrated in FIG. 9, is the use of aT-shaped board represented by dashed lines 144. Thus, the presentinvention can be adapted to be used in conjunction with various boardsand board configurations.

FIG. 10 illustrates an adapter 150 similar to the connector 142 of theadapter 140 shown in FIG. 9. The adapter 150 is comprised of a singleconnector 152 that may be adhesively or otherwise attached to a SIMMboard and is configured to resemble the portion of a conventional SIMMboard that it is replacing. Preferably, an adhesive or other bondingmaterial is applied to at least a portion of surface 154 and the surface154 is attached to the back of a SIMM board with abutment portion 156abutting the side of the SIMM board. If only one side of a SIMM board isbeing replaced, then only one connector 152 is needed. A similaradapter, however, could be used for the opposite side of the SIMM board.

FIG. 11 generally illustrates the module adapter 200 of the presentinvention installed on another circuit board 202 having a connector 204therein. The module adapter 200 illustrates the various embodiments ofthe present invention shown in drawing FIGS. 2 through 10 set forth anddescribed hereinbefore wherein the module adapter comprises either anadapter housing 40, an adapter 70 comprising a housing having only oneside wall 72 extending between the end portions or connectors 74 and 76,an adapter 80 comprised of two connectors or end portions 84 and 86, anadapter 110 having a pair of C-shaped side walls 112 and 114, an adapter130 comprising retaining members 132 and 134 held in relative relationto one another by a slotted or channeled cross-member 136, an adapter140 comprised of two connectors or retaining members 142 and 144, or anadapter 150 comprised of a single connector 152 attached to a portion ofa SIMM board.

Referring to drawing FIG. 12, the module and module adapter 200 is shownin conjunction with a computer 300 being connected to a circuit board302 therein. In this manner, a module and module adapter 200, the modulehaving a variety of components therein, can be connected to any circuitboard 302 of a computer 300 for use therewith.

In addition to the embodiments illustrating adapters formed fromsingle-piece molded plastics and the like, it will be appreciated bythose skilled in the art, that separate components and/or componentmaterial could be combined to form such an adapter. Moreover, it will beappreciated by those skilled in the art that variously configured memorymodules could be benefitted by the adapters of the present invention.Further, while the invention has been describe with relation to memorydevices, the invention may be practiced on many other multi-chip moduleswhere it is desirable to save printed circuit board or other substratematerial.

It should be noted that the term "SIMM" as used in the specification andappended claims is intended as exemplary and not limiting, the inventionhaving applicability to any multi-chip module. In addition, whilepreferred embodiments were illustrated as having packaged dice attachedto the SIMM board, the invention makes possible the use of bare dicethat are wire bonded, flip-chip bonded, or otherwise connected to thesubstrate.

It will also be appreciated by one of ordinary skill in the art that oneor more features of any of the illustrated embodiments may be combinedwith one or more features from another to form yet another combinationwithin the scope of the invention as described and claimed herein. Forexample, each of the adapters could be L-shaped to secure a portion ofthe top edge and sides of the module board. Thus, while certainrepresentative embodiments and details have been shown for purposes ofillustrating the invention, it will be apparent to those skilled in theart that various changes in the invention disclosed herein may be madewithout departing from the scope of the invention, which is defined inthe appended claims.

What is claimed is:
 1. A module adapter connecting a module board havinga plurality of sides to a module socket of another board, said moduleadapter comprising:a holder, said module board positioned within saidholder, said holder including a housing having at least onelongitudinally extending side wall; potting material interposed at leastpartially between said at least one longitudinally extending side walland said module board; and at least one chip attached to said moduleboard.
 2. The module adapter of claim 1, wherein said holder includes:afirst connector attached to a first side of said module board and asecond connector attached to a second side of said module board.
 3. Themodule adapter of claim 2, wherein said first and second connectors areconfigured to be at least partially received within said module socketof said another board.
 4. The module adapter of claim 3, wherein saidfirst and second connectors are spaced to substantially fit within saidmodule socket of said another board.
 5. The module adapter of claim 4,wherein at least a portion of said module board is substantially sizedand configured to fit between said first and second connectors.
 6. Themodule adapter of claim 2, wherein said holder includes:at least onecross-member depending from and extending between said first connectorand said second connector.
 7. The module adapter of claim 1, whereinsaid at least one longitudinally extending side wall is spaced asufficient distance above said module board to house said at least onechip.
 8. The module board adapter of claim 1, wherein said moduleincludes:a single-in-line memory module.
 9. The module adapter of claim1, wherein said module board comprises:a printed circuit board.
 10. Themodule adapter of claim 1, wherein said module board comprises an FR-4board.
 11. The module adapter of claim 1, wherein said module board isshorter in length than a similarly configured conventional module board.12. A module configured to be connected to a socket, comprising:aholder, said holder including a housing having at least onelongitudinally extending side wall; a module board positioned withinsaid holder; potting material interposed at least partially between saidat least one longitudinally extending side wall and said module board;and at least one chip attached to said module board.
 13. The module ofclaim 12, wherein said holder includes:a first connector attached to afirst side of said module board and a second connector attached to asecond side of said module board.
 14. The module of claim 13, whereinsaid first and second connectors are configured to be at least partiallyreceived within the socket.
 15. The module of claim 14, wherein saidfirst and second connectors are spaced to properly fit within thesocket.
 16. The module of claim 14, wherein at least a portion of saidmodule is sized and configured to fit between said first and secondconnectors.
 17. The module of claim 13, wherein said holder includes atleast one crossmember depending from and extending between said firstconnector and said second connector.
 18. The module of claim 12, whereinsaid at least one longitudinally extending side wall is spaced asufficient distance above said module board to house said at least onechip.
 19. The module of claim 12, wherein said module is a singlein-line memory module.
 20. The module of claim 12, wherein said moduleboard is a printed circuit board.
 21. The module of claim 12, whereinsaid module board comprises an FR-4 board.
 22. The module of claim 12,wherein said module board is shorter in length than a similarlyconfigured conventional module board.
 23. A method of manufacturing amodule configured for connection to a socket, said method comprising thesteps of:forming a module board socket adapter having a first boardretaining member and a second board retaining member; and attaching areduced-size module board at least partially within said first andsecond board retaining members said attaching including adhesivelyattaching said module board to said module board socket adapter.
 24. Themethod of claim 23, wherein the step of forming said module board socketadapter includes having a first tab depending from said first boardretaining member and a second tab depending from said second boardretaining member, said first and second tabs configured to be receivedat least partially within the socket.
 25. The method of claim 23,wherein said attaching includes sliding said module board into saidmodule board socket adapter.
 26. The method of claim 23, wherein saidattaching includes snapping said module board into said module boardsocket adapter.
 27. The method of claim 23, further including the stepof:potting at least a portion of said module board within said moduleboard socket adapter.
 28. A memory module adapter for connecting amodule board having a plurality of sides to an industry-standard modulesocket of another board, said memory module adapter comprising:a holder,said module board positioned within said holder, said holder including ahousing having at least one longitudinally extending side wall; pottingmaterial interposed at least partially between said at least onelongitudinally extending side wall and said module board; and at leastone memory chip attached to said module board.
 29. The memory moduleadapter of claim 28, wherein said holder includes:a first connectorattached to a first side of said module board and a second connectorattached to a second side of said module board.
 30. The memory moduleadapter of claim 29, wherein said holder includes:at least onecross-member depending from and extending between said first connectorand said second connector.
 31. The memory module adapter of claim 28,wherein said at least one longitudinally extending side wall is spaced asufficient distance above said module board to house said at least onememory chip.
 32. The module board adapter of claim 28, wherein saidmemory module includes:a single-in-line memory module.
 33. The memorymodule adapter of claim 28, wherein said module board includes:a printedcircuit board.
 34. The memory module adapter of claim 28, wherein saidmodule board comprises an FR-4 board.
 35. A memory module configured tobe connected to a predetermined shape socket, comprising:a holderincluding a housing having at least one longitudinally extending sidewall; a module board positioned within said holder; potting materialinterposed at least partially between said at least one longitudinallyextending side wall and said module board; and at least one memory chipattached to said module board.
 36. The memory module of claim 35,wherein said holder includes:a first connector attached to a first sideof said module board and a second connector attached to a second side ofsaid module board.
 37. The memory module of claim 36, wherein saidholder includes at least one cross-member depending from and extendingbetween said first connector and said second connector.
 38. The memorymodule of claim 35, wherein said at least one longitudinally extendingside wall is spaced a sufficient distance above said module board tohouse said at least one memory chip.